"Convergence of computing capabilities and communication protocols has resulted in the development of devices with enhanced functionalities and capabilities. Providing a range of functions at a low cost while maintaining the reliability and compatibility of existing systems and devices is a major challenge today," says Frost & Sullivan Research Analyst Vedavalli Rangan. "As devices become more complex with numerous features, it is of prime importance to find out ways to extract more power from the batteries."

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Moreover, the circuit complexity that comes with the use of isolated application specific chips, as found in traditional systems, is compelling chip manufacturers to focus on curbing power dissipation right at the design stage.

The emergence of wireless communications with embedded intelligence is playing an important role in reducing power consumption.

The elimination of delays due to the absence of buses for interchip communications as seen in System on Chip (SoC) designs considerably improve device performance.

The SoC design that follows Moore's Law consists of the microprocessor, the digital signal processor that runs the embedded software, the memories and application specific chips, and other peripherals, all in one single chip.

SoC basically allows chip manufacturers to reduce the extra cost incurred in the design and fabrication of application-specific chips by integrating the entire system functionality on a single chip along with the core processor components.

Despite the many benefits of SoC, various design level challenges are present due to the lack of specific standards for implementation. There is a need for tools that can perform system-level verification in a virtual environment before entering the actual manufacturing cycle.

Manufacturers are now working toward developing energy efficient chips by increasing the speed. Instead of SoC solutions, System-in-Package (SiP) solutions that come with necessary software are expected to gain in popularity as they eliminate problems relating to vendor interoperability.

The Wireless Internet on a Chip research service deals with the evolving nature of technology in the Internet on a Chip market with a focus on the wireless domain. The study also discusses the latest technologies and the trends driving the development of integrated single chip solutions for wireless Internet access. Executive summaries and analyst interviews are available to the press.

Technical Insights is an international technology analysis business that produces a variety of technical news alerts, newsletters, and research services.

Frost & Sullivan, a global growth consulting company, has been partnering with clients to support the development of innovative strategies for more than 40 years. The company's industry expertise integrates growth consulting, growth partnership services, and corporate management training to identify and develop opportunities. Frost & Sullivan serves an extensive clientele that includes Global 1000 companies, emerging companies, and the investment community by providing comprehensive industry coverage that reflects a unique global perspective and combines ongoing analysis of markets, technologies, econometrics, and demographics. For more information, visit www.frost.com.

Wireless Internet on a Chip

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Keywords in this release: wireless, Internet on a chip, System on Chip, SoC, microprocessor, digital signal processor and application specific chips

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    Corporate Communications - North America
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